CY62128EV30LL-45ZAXI | 赛普拉斯半导体

You are here

CY62128EV30LL-45ZAXI
Status: 生产中

数据手册

(pdf, 939.6 KB) RoHS PB Free

CY62128EV30LL-45ZAXI

合格汽车
密度 (Kb)1024
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.20
组织 (X x Y)128K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
速率 (ns)45
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.96 $1.65 $1.48 $1.30 $1.22 $1.15
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 125 24-48 hours

Packaging/Ordering

工具包
SOP
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
468
Order Increment
468
Estimated Lead Time (days)
315
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (2)

产品变更通知 (PCN) (9)

2021 年 2 月 14 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 32-Lead TSOP I Package Memory Products
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Addendum to PCN 115091-TSOP 8 X 13.4 Tray Modification (Bottom Pocket Fence)

Advanced Product Change Notice (APCN) (4)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
2020 年 4 月 14 日
2020 Annual Horizon Report Update

Product Information Notice (PIN) (5)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2009 年 9 月 24 日

VHDL (1)

2009 年 9 月 02 日