CY62146EV30LL-45BVXIT | 赛普拉斯半导体

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CY62146EV30LL-45BVXIT
Status: 生产中

数据手册

(pdf, 592.05 KB) RoHS PB Free

CY62146EV30LL-45BVXIT

Development Kit
合格汽车
最高工作温度 (°C)85
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.20
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.68 $6.46 $5.76 $5.06 $4.78 $4.47
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
BGA
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

技术文档

应用笔记 (2)

产品变更通知 (PCN) (5)

2020 年 9 月 16 日
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial Grade 4Mb MoBL® SRAM Products
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 28 日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018 年 5 月 28 日
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2017 年 10 月 31 日
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2009 年 9 月 02 日

IBIS (1)

2009 年 9 月 02 日