CY62148EV30LL-45ZSXIT | 赛普拉斯半导体
CY62148EV30LL-45ZSXIT
| 合格汽车 | 否 |
| 密度 (Kb) | 4096 |
| 频率 (MHz) | 无 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.20 |
| 组织 (X x Y) | 512K x 8 |
| Part Family | Async Micropower (MoBL) SRAMs |
| 速率 (ns) | 45 |
| Tape & Reel | 是 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.77 | $4.00 | $3.58 | $3.15 | $2.97 | $2.78 |
Packaging/Ordering
工具包
No. of Pins
32
Package Dimensions
820 L x 1 H x 435 W (Mils)
Package Weight
436.42 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 11 月 05 日
Last Update: 2019 年 10 月 30 日
技术文档
应用笔记 (2)
产品变更通知 (PCN) (8)
2020 年 8 月 25 日
Qualification of Unimos Shanghai as an Additional Assembly Site for Select 32-Lead TSOP II Package
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
2017 年 10 月 31 日
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Advanced Product Change Notice (APCN) (5)
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (7)
2020 年 7 月 06 日
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
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