CY62148EV30LL-55SXIT | 赛普拉斯半导体

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CY62148EV30LL-55SXIT
Status: 生产中

数据手册

(pdf, 990.79 KB) RoHS PB Free

CY62148EV30LL-55SXIT

合格汽车
密度 (Kb)4096
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
Min. Operating VCCQ (V)2.20
最低工作电压 (V)2.20
组织 (X x Y)512K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
速率 (ns)55
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.16 $5.18 $4.62 $4.06 $3.84 $3.58
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
32
Package Dimensions
810 L x 0 H x 450 W (Mils)
Package Weight
1 340.00 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2019 年 2 月 13 日

技术文档

应用笔记 (2)

产品变更通知 (PCN) (10)

2020 年 5 月 08 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Qualification of KEG6000DA and KEG3000DA Green Mold Compound for 32 leads, Lead-free and standard, 450 mil body size, SOIC Packages Assembled at Cypress
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Advanced Product Change Notice (APCN) (4)

2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
2020 年 4 月 14 日
2020 Annual Horizon Report Update
2020 年 4 月 14 日
Q419 Horizon Report Update

Product Information Notice (PIN) (6)

2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2020 年 4 月 14 日
Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2009 年 9 月 02 日

IBIS (1)

2009 年 9 月 02 日