CY62157EV18LL-55BVXI | 赛普拉斯半导体

You are here

CY62157EV18LL-55BVXI
Status: 生产中

数据手册

(pdf, 561.96 KB) RoHS PB Free

CY62157EV18LL-55BVXI

合格汽车
最高工作温度 (°C)85
最高工作电压 (V)2.25
最低工作温度 (°C)-40
最低工作电压 (V)1.65
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.23 $8.60 $7.67 $6.74 $6.37 $5.95
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
BGA
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
112
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

技术文档

应用笔记 (2)

产品变更通知 (PCN) (12)

2020 年 5 月 8 日
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
2020 年 4 月 14 日
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 8Mb MoBL SRAM Products
2020 年 4 月 14 日
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 29 日
Qualification of 6x8x1.0 mm 48 FBGA products at Cypress Philippines
2018 年 5 月 28 日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Advanced Product Change Notice (APCN) (3)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
2020 Annual Horizon Report Update

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2012 年 5 月 30 日

VHDL (1)

2009 年 9 月 02 日