CY62157EV18LL-55BVXI | 赛普拉斯半导体
CY62157EV18LL-55BVXI
| 合格汽车 | 否 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 2.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 1.65 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $10.23 | $8.60 | $7.67 | $6.74 | $6.37 | $5.95 |
Packaging/Ordering
工具包
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
112
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 6 月 03 日
Last Update: 2018 年 6 月 26 日
技术文档
应用笔记 (2)
产品变更通知 (PCN) (12)
2020 年 5 月 8 日
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
2020 年 4 月 14 日
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 8Mb MoBL SRAM Products
2020 年 4 月 14 日
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 28 日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (4)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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