CY62167DV30LL-55BVXI | 赛普拉斯半导体

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CY62167DV30LL-55BVXI
Status: 生产中

数据手册

(pdf, 327.87 KB) RoHS PB Free

CY62167DV30LL-55BVXI

合格汽车
最高工作温度 (°C)85
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.20
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.97 $11.75 $10.48 $9.21 $8.70 $8.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
BGA
No. of Pins
48
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
118.27 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
210
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

IPC 1752 材料成分声明

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 15 日

技术文档

应用笔记 (2)

产品变更通知 (PCN) (12)

2018 年 5 月 28 日
Qualification of Cypress Manufacturing Limited as an additional assembly site for 48-FBGA 8X9.5X1.0mm Pb-Free package
2018 年 5 月 28 日
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
2018 年 5 月 28 日
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 8x9.5mm BGA Packages Using SnAgCu Solder Balls
2018 年 5 月 28 日
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
2018 年 5 月 28 日
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 2 月 15 日
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2012 年 4 月 03 日