CY62167ELL-45ZXI | 赛普拉斯半导体

CY62167ELL-45ZXI
Status: 生产中

数据手册

(pdf, 529.61 KB) RoHS PB Free

CY62167ELL-45ZXI

合格汽车
最高工作温度 (°C)85
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)4.50
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$16.50 $13.88 $12.38 $10.88 $10.28 $9.60
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (2)

产品变更通知 (PCN) (8)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 2 月 15 日
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017 年 10 月 11 日
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Product Information Notice (PIN) (5)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2012 年 3 月 09 日

VHDL (1)

2009 年 9 月 02 日