CY7B9930V-5AXC | 赛普拉斯半导体
CY7B9930V-5AXC
合格汽车 | 否 |
Core Voltage (V) | 3.3 |
I/O Voltage (V) | 3.3 |
Input Frequency Max. (MHz) | 100 |
Input Frequency Min. (MHz) | 12 |
Input Signal Type | LVTTL, LVPECL |
最高工作温度 (°C) | 70 |
最高工作电压 (V) | 3.60 |
最低工作温度 (°C) | 0 |
最低工作电压 (V) | 3.00 |
No. of Outputs | 10 |
No. of PLL | 1 |
Output Frequency Max. (MHz) | 100 |
Output Frequency Min. (MHz) | 12 |
Output Signal Type | LVTTL |
Spread Spectrum | 否 |
Tape & Reel | 否 |
温度分类 | 商用 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$41.27 | $33.67 | $31.71 | $29.76 | $28.89 | $27.80 |
Packaging/Ordering
工具包
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
160
Minimum Order Quantity (MOQ)
160
Order Increment
160
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 7 月 10 日
Package Qualification Report
Last Update: 2018 年 8 月 09 日
Last Update: 2015 年 8 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 20 日
技术文档
产品变更通知 (PCN) (11)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (2)
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement