CY7B993V-2AXC | 赛普拉斯半导体

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CY7B993V-2AXC
Status: 废弃

数据手册

(pdf, 584.61 KB) RoHS PB Free

CY7B993V-2AXC

合格汽车
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)100
Input Frequency Min. (MHz)12
Input Signal TypeLVTTL, LVPECL
最高工作温度 (°C)70
最高工作电压 (V)3.60
最低工作温度 (°C)0
最低工作电压 (V)3.00
No. of Outputs18
No. of PLL1
Output Frequency Max. (MHz)100
Output Frequency Min. (MHz)12
Output Signal TypeLVTTL
Spread Spectrum
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$40.95 $33.40 $31.46 $29.52 $28.66 $27.58
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
QFP
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

产品变更通知 (PCN) (11)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (6)

2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Q419 Automotive Horizon Report Update
2020 年 4 月 14 日
Q319 Horizon Report Update
2020 年 4 月 14 日
Q319 Automotive Horizon Report Update
2020 年 4 月 14 日
2019 Horizon Report: Q2 Update
2020 年 4 月 14 日
2019 Automotive Horizon Report: Q2 Update

Product Information Notice (PIN) (2)

2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (1)

2020 年 4 月 14 日
April 2019 Product Obsolescence Notification

IBIS (1)

2010 年 8 月 12 日