CY7B994V-2BBXIT | 赛普拉斯半导体
CY7B994V-2BBXIT
合格汽车 | 否 |
Core Voltage (V) | 3.3 |
I/O Voltage (V) | 3.3 |
Input Frequency Max. (MHz) | 200 |
Input Frequency Min. (MHz) | 24 |
Input Signal Type | LVTTL, LVPECL |
最高工作温度 (°C) | 85 |
最高工作电压 (V) | 3.60 |
最低工作温度 (°C) | -40 |
最低工作电压 (V) | 3.00 |
No. of Outputs | 18 |
No. of PLL | 1 |
Output Frequency Max. (MHz) | 200 |
Output Frequency Min. (MHz) | 24 |
Output Signal Type | LVTTL |
Spread Spectrum | 否 |
Tape & Reel | 是 |
温度分类 | 工业 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$58.98 | $49.88 | $47.85 | $45.50 | $44.48 | $43.14 |
Packaging/Ordering
工具包
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Qualification Report
Last Update: 2015 年 8 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 20 日
技术文档
产品变更通知 (PCN) (6)
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls