CY7C1011DV33-10BVXI | 赛普拉斯半导体

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CY7C1011DV33-10BVXI
Status: 生产中

数据手册

(pdf, 499.64 KB) RoHS PB Free

CY7C1011DV33-10BVXI

Development Kit
合格汽车
密度 (Kb)2048
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
Min. Operating VCCQ (V)3.00
最低工作电压 (V)3.00
组织 (X x Y)128K x 16
Part Family快速异步 SRAM
速率 (ns)10
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.81 $4.88 $4.36 $3.83 $3.62 $3.38
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
BGA
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

技术文档

应用笔记 (1)

产品变更通知 (PCN) (11)

2020 年 5 月 8 日
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
2020 年 5 月 8 日
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018 年 5 月 29 日
Qualification of 6x8x1.0 mm 48 FBGA products at Cypress Philippines
2018 年 5 月 28 日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018 年 5 月 28 日
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (3)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2009 年 9 月 15 日

IBIS (1)

2009 年 9 月 15 日