CY7C1020CV26-15ZSXET | 赛普拉斯半导体

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CY7C1020CV26-15ZSXET
Status: 生产中

数据手册

(pdf, 289.13 KB) RoHS PB Free

CY7C1020CV26-15ZSXET

Development Kit
合格汽车
密度 (Kb)512
频率 (MHz)
最高工作温度 (°C)125
Max. Operating VCCQ (V)2.70
最高工作电压 (V)2.70
最低工作温度 (°C)-40
Min. Operating VCCQ (V)2.50
最低工作电压 (V)2.50
组织 (X x Y)32K x 16
速率 (ns)15
Tape & Reel
温度分类Automotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.94 $5.00 $4.46 $3.92 $3.70 $3.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (1)

产品变更通知 (PCN) (6)

2018 年 6 月 14 日
2018 年 5 月 29 日
Qualification of Chipmos,Taiwan as an additional Burn In site for 44 pin TSOP II Package for selected automotive grade SRAMs
2018 年 5 月 28 日
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 20 日
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs

Advanced Product Change Notice (APCN) (2)

2020 年 3 月 08 日
2020 年 1 月 21 日

Product Information Notice (PIN) (8)

2020 年 1 月 07 日
2019 年 12 月 21 日
2019 年 9 月 26 日
2018 年 5 月 27 日
Qualification of ChipMOS Taiwan as an additional Burn-In, Test and Finish site for select automotive grade products in 44-pin TSOP II and 100-pin TQFP packages
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 10 月 25 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
2017 年 10 月 25 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).

白皮书 (1)

2016 年 4 月 12 日

IBIS (1)

2012 年 6 月 27 日