CY7C1150KV18-400BZXC | 赛普拉斯半导体
CY7C1150KV18-400BZXC
架构 | DDR-II+ CIO |
合格汽车 | 否 |
突发长度(字) | 2 |
密度 (Kb) | 18432 |
Density (Mb) | 18 |
频率 (MHz) | 400 |
最高工作温度 (°C) | 70 |
Max. Operating VCCQ (V) | 1.90 |
最高工作电压 (V) | 1.90 |
最低工作温度 (°C) | 0 |
Min. Operating VCCQ (V) | 1.40 |
最低工作电压 (V) | 1.70 |
组织 (X x Y) | 512Kb x 36 |
Tape & Reel | 否 |
温度分类 | 商用 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$43.23 | $38.56 | $35.76 | $32.95 | $31.78 | $30.38 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | 联系销售人员 | Checking For Inventory |
Packaging/Ordering
工具包
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
35
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
封装材料声明
Last Update: 2016 年 11 月 09 日
Package Qualification Report
Last Update: 2016 年 9 月 15 日
技术文档
应用笔记 (5)
产品变更通知 (PCN) (5)
2017 年 10 月 24 日
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products