CY7C1312BV18-200BZXC | 赛普拉斯半导体

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CY7C1312BV18-200BZXC
Status: 废弃

CY7C1312BV18-200BZXC

架构QDR-II
合格汽车
突发长度(字)2
密度 (Kb)18432
Density (Mb)18
频率 (MHz)200
最高工作温度 (°C)70
Max. Operating VCCQ (V)1.90
最高工作电压 (V)1.90
最低工作温度 (°C)0
Min. Operating VCCQ (V)1.40
最低工作电压 (V)1.70
组织 (X x Y)1Mb x 18
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$33.36 $29.75 $27.59 $25.42 $24.52 $23.44
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

封装材料声明

技术文档

应用笔记 (5)

产品变更通知 (PCN) (7)

2018 年 5 月 28 日
Release of 18M QDRII/DDRII/QDRII+/DDRII+ (Phase II) Synchronous SRAM Products in 65nm Technology
2018 年 5 月 28 日
Change of BGA165 tray from 126 units per tray to 119 units per tray
2018 年 5 月 28 日
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
2018 年 5 月 28 日
Datasheet Changes to 18Mb/36Mb/72Mb Burst of 2/4 QDR-I/DDR-I/QDR-II/DDR-II Products
2018 年 5 月 28 日
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
2018 年 5 月 27 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165BGA 13x15x1.4mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2018 年 5 月 27 日
Shipping Label Upgrade

Verilog (1)

2008 年 11 月 13 日

VHDL (1)

2008 年 11 月 13 日

BSDL (1)

2008 年 11 月 13 日

IBIS (1)

2008 年 11 月 13 日