CY7C1321KV18-250BZCT | 赛普拉斯半导体

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CY7C1321KV18-250BZCT
Status: 生产中

数据手册

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CY7C1321KV18-250BZCT

架构DDR-II CIO
合格汽车
突发长度(字)4
密度 (Kb)18432
Density (Mb)18
频率 (MHz)250
最高工作温度 (°C)70
Max. Operating VCCQ (V)1.90
最高工作电压 (V)1.90
最低工作温度 (°C)0
Min. Operating VCCQ (V)1.40
最低工作电压 (V)1.70
组织 (X x Y)512Kb x 36
Part FamilyDDR-II CIO
Part FamilyDDR-II CIO
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$28.42 $25.34 $23.50 $21.66 $20.89 $19.97
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
BGA
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Pb

封装材料声明

技术文档

应用笔记 (5)

产品变更通知 (PCN) (7)

2020 年 4 月 14 日
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of 65nm products without Nitride Seal Mask (NSM)
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
2017 年 10 月 24 日
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products

Product Information Notice (PIN) (5)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (1)

2016 年 10 月 25 日

BSDL (1)

2011 年 5 月 27 日

Verilog (1)

2011 年 1 月 05 日