CY7C1321KV18-250BZXCT | 赛普拉斯半导体
CY7C1321KV18-250BZXCT
| 架构 | DDR-II CIO |
| 合格汽车 | 否 |
| 突发长度（字） | 4 |
| 密度 (Kb) | 18432 |
| Density (Mb) | 18 |
| 频率 (MHz) | 250 |
| 最高工作温度 (°C) | 70 |
| Max. Operating VCCQ (V) | 1.90 |
| 最高工作电压 (V) | 1.90 |
| 最低工作温度 (°C) | 0 |
| Min. Operating VCCQ (V) | 1.40 |
| 最低工作电压 (V) | 1.70 |
| 组织 (X x Y) | 512Kb x 36 |
| Part Family | DDR-II CIO |
| Part Family | DDR-II CIO |
| Tape & Reel | 是 |
| 温度分类 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $28.42 | $25.34 | $23.50 | $21.66 | $20.89 | $19.97 |
Packaging/Ordering
工具包
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
封装材料声明
Last Update: 2016 年 11 月 09 日
技术文档
应用笔记 (5)
产品变更通知 (PCN) (7)
2020 年 4 月 14 日
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 24 日
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Product Information Notice (PIN) (5)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
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