CY7C1356C-166BGC | 赛普拉斯半导体

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CY7C1356C-166BGC
Status: 废弃

数据手册

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CY7C1356C-166BGC

架构NoBL, Pipeline
合格汽车
密度 (Kb)9216
Density (Mb)9
频率 (MHz)166
最高工作温度 (°C)70
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.63
最低工作温度 (°C)0
Min. Operating VCCQ (V)2.40
最低工作电压 (V)3.14
组织 (X x Y)512Kb x 18
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.93 $12.42 $11.52 $10.62 $10.24 $9.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
84
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Pb

封装材料声明

Last Update: 2016 年 12 月 14 日

技术文档

应用笔记 (3)

产品变更通知 (PCN) (5)

2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 27 日
Qualification of Green Mold Compound for select packages at ASE Taiwan
2018 年 5 月 27 日
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
2018 年 5 月 27 日
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
2018 年 5 月 27 日
Shipping Label Upgrade

Product Termination Notice (PTN) (1)

2017 年 11 月 09 日
December 2012 Product Obsolescence Notification

IBIS (1)

2010 年 11 月 22 日

Verilog (1)

2010 年 11 月 18 日

VHDL (1)

2008 年 11 月 13 日

BSDL (1)

2008 年 11 月 13 日