CY7C1370D-200AXCT | 赛普拉斯半导体
CY7C1370D-200AXCT
| 架构 | NoBL, Pipeline |
| 合格汽车 | 否 |
| 密度 (Kb) | 18432 |
| Density (Mb) | 18 |
| 频率 (MHz) | 200 |
| 最高工作温度 (°C) | 70 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.63 |
| 最低工作温度 (°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| 最低工作电压 (V) | 3.14 |
| 组织 (X x Y) | 512Kb x 36 |
| Tape & Reel | 是 |
| 温度分类 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $30.69 | $27.37 | $25.38 | $23.39 | $22.56 | $21.57 |
Packaging/Ordering
工具包
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
750
Minimum Order Quantity (MOQ)
750
Order Increment
750
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2021 年 3 月 05 日
Last Update: 2020 年 5 月 11 日
Package Qualification Report
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 15 日
技术文档
应用笔记 (3)
产品变更通知 (PCN) (12)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Addendum to PCN161201:18Mb Technology Transition from 90nm to 65nm (18Mb Sync and NoBL Products)
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (4)
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
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