CY7C1370D-200BZIT | 赛普拉斯半导体
CY7C1370D-200BZIT
Status: 废弃
CY7C1370D-200BZIT
| 架构 | NoBL, Pipeline |
| 合格汽车 | 否 |
| 密度 (Kb) | 18432 |
| Density (Mb) | 18 |
| 频率 (MHz) | 200 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.63 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 2.40 |
| 最低工作电压 (V) | 3.14 |
| 组织 (X x Y) | 512Kb x 36 |
| Tape & Reel | 是 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $36.32 | $32.39 | $30.03 | $27.68 | $26.70 | $25.52 |
Packaging/Ordering
工具包
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
否
无铅
否
Lead/Ball Finish
Sn/Pb
Marking
封装材料声明
Last Update: 2017 年 9 月 04 日
技术文档
应用笔记 (3)
产品变更通知 (PCN) (9)
2020 年 4 月 14 日
Addendum to PCN161201:18Mb Technology Transition from 90nm to 65nm (18Mb Sync and NoBL Products)
2018 年 5 月 28 日
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
2018 年 5 月 28 日
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
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