CY7C1370D-200BZIT | 赛普拉斯半导体

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CY7C1370D-200BZIT
Status: 废弃

CY7C1370D-200BZIT

架构NoBL, Pipeline
合格汽车
密度 (Kb)18432
Density (Mb)18
频率 (MHz)200
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.63
最低工作温度 (°C)-40
Min. Operating VCCQ (V)2.40
最低工作电压 (V)3.14
组织 (X x Y)512Kb x 36
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$36.32 $32.39 $30.03 $27.68 $26.70 $25.52
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Pb

封装材料声明

技术文档

应用笔记 (3)

产品变更通知 (PCN) (9)

2020 年 4 月 14 日
Addendum to PCN161201:18Mb Technology Transition from 90nm to 65nm (18Mb Sync and NoBL Products)
2018 年 5 月 28 日
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
2018 年 5 月 28 日
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
2018 年 5 月 27 日
Shipping Label Upgrade
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (2)

2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

Verilog (1)

2010 年 11 月 22 日

IBIS (1)

2010 年 11 月 22 日

VHDL (1)

2008 年 11 月 13 日

BSDL (1)

2008 年 11 月 13 日