CY7C1399BN-12VXIT | 赛普拉斯半导体

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CY7C1399BN-12VXIT
Status: 生产中

数据手册

(pdf, 419.63 KB) RoHS PB Free

CY7C1399BN-12VXIT

合格汽车
密度 (Kb)256
频率 (MHz)
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
Min. Operating VCCQ (V)3.00
最低工作电压 (V)3.00
组织 (X x Y)32K x 8
Part Family快速异步 SRAM
速率 (ns)12
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.99 $2.52 $2.24 $1.97 $1.86 $1.74
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
28
Package Dimensions
705 L x 1 H x 300 W (Mils)
Package Weight
868.67 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (1)

产品变更通知 (PCN) (9)

2020 年 9 月 20 日
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 7 月 29 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report

Advanced Product Change Notice (APCN) (4)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
2020 年 4 月 14 日
2020 Annual Horizon Report Update

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2012 年 4 月 02 日