CY7C1399BN-12VXIT | 赛普拉斯半导体
CY7C1399BN-12VXIT
| 合格汽车 | 否 |
| 密度 (Kb) | 256 |
| 频率 (MHz) | 无 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| 最低工作电压 (V) | 3.00 |
| 组织 (X x Y) | 32K x 8 |
| Part Family | 快速异步 SRAM |
| 速率 (ns) | 12 |
| Tape & Reel | 是 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.99 | $2.52 | $2.24 | $1.97 | $1.86 | $1.74 |
Packaging/Ordering
工具包
No. of Pins
28
Package Dimensions
705 L x 1 H x 300 W (Mils)
Package Weight
868.67 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 7 月 20 日
技术文档
应用笔记 (1)
产品变更通知 (PCN) (9)
2020 年 9 月 20 日
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 7 月 29 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Advanced Product Change Notice (APCN) (4)
2020 年 4 月 14 日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (4)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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