CY7C1399BN-12ZXC | 赛普拉斯半导体

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CY7C1399BN-12ZXC
Status: 废弃

数据手册

(pdf, 419.63 KB) RoHS PB Free

CY7C1399BN-12ZXC

合格汽车
密度 (Kb)256
频率 (MHz)
最高工作温度 (°C)70
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)0
Min. Operating VCCQ (V)3.00
最低工作电压 (V)3.00
组织 (X x Y)32K x 8
Part Family快速异步 SRAM
速率 (ns)12
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.51 $2.11 $1.88 $1.65 $1.56 $1.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
702
Order Increment
702
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

应用笔记 (1)

产品变更通知 (PCN) (9)

2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
TSOP Tray Modification (Bottom Pocket Fence)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Advanced Product Change Notice (APCN) (1)

2020 年 8 月 23 日
Q32020 Horizon Report Update

Product Information Notice (PIN) (5)

2020 年 6 月 14 日
Supply Update for Asynchronous SRAM 28-Lead TSOP (ZT28R) Package.
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 5 月 7 日
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

2020 年 5 月 11 日
Addendum to PTN195105A - January 2020 Product Obsolescence Notification
2020 年 4 月 14 日
Addendum to PTN195105 - January 2020 Product Obsolescence Notification
2020 年 4 月 14 日
January 2020 Product Obsolescence Notification

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2012 年 4 月 02 日