CY7C1412AV18-167BZXI | 赛普拉斯半导体

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CY7C1412AV18-167BZXI
Status: 废弃

CY7C1412AV18-167BZXI

架构QDR-II
合格汽车
突发长度(字)2
密度 (Kb)36864
Density (Mb)36
频率 (MHz)167
最高工作温度 (°C)85
Max. Operating VCCQ (V)1.90
最高工作电压 (V)1.90
最低工作温度 (°C)-40
Min. Operating VCCQ (V)1.40
最低工作电压 (V)1.70
组织 (X x Y)2Mb x 18
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$53.67 $47.87 $44.39 $40.90 $39.45 $37.71
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
645.61 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

技术文档

应用笔记 (5)

产品变更通知 (PCN) (5)

2018 年 5 月 28 日
Release of 36M QDRII/DDRII/QDRII+/DDRII+ (Phase II) Synchronous SRAM Products in 65nm Technology
2018 年 5 月 28 日
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
2018 年 5 月 28 日
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
2018 年 5 月 28 日
Datasheet Changes to 18Mb/36Mb/72Mb Burst of 2/4 QDR-I/DDR-I/QDR-II/DDR-II Products
2018 年 5 月 27 日
Shipping Label Upgrade

Product Errata Notice (PEN) (1)

2017 年 10 月 30 日
Product Errata Notification - RAM9 QDR-I/DDR-I/QDR-II/DDR-II Errata

IBIS (1)

2010 年 11 月 19 日

VHDL (1)

2010 年 1 月 05 日

BSDL (1)

2008 年 11 月 13 日

Verilog (1)

2008 年 11 月 13 日