CY7C1441AV33-133BZXI | 赛普拉斯半导体
CY7C1441AV33-133BZXI
| 架构 | Standard Sync, Flow-through |
| 合格汽车 | 否 |
| 密度 (Kb) | 36864 |
| Density (Mb) | 36 |
| 频率 (MHz) | 133 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最高工作电压 (V) | 3.63 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 2.40 |
| 最低工作电压 (V) | 3.14 |
| 组织 (X x Y) | 1Mb x 36 |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $62.16 | $55.44 | $51.41 | $47.38 | $45.70 | $43.68 |
Packaging/Ordering
工具包
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
645.61 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Qualification Report
技术文档
应用笔记 (2)
产品变更通知 (PCN) (6)
2018 年 5 月 28 日
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 24 日
36Mb Standard Sync and NoBL SRAM Products: Technology Transition from 90nm to 65nm Process
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