CY7C1472V25-200AXC | 赛普拉斯半导体

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CY7C1472V25-200AXC
Status: 生产中

数据手册

(pdf, 767.28 KB) RoHS PB Free

CY7C1472V25-200AXC

架构NoBL, Pipeline
合格汽车
密度 (Kb)73728
Density (Mb)72
频率 (MHz)200
最高工作温度 (°C)70
Max. Operating VCCQ (V)2.60
最高工作电压 (V)2.63
最低工作温度 (°C)0
Min. Operating VCCQ (V)2.40
最低工作电压 (V)2.38
组织 (X x Y)4Mb x 18
Part FamilyNoBL
Part FamilyNoBL
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$156.80 $132.61 $128.13 $122.75 $119.17 $115.58
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
FP
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
72
Order Increment
72
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

应用笔记 (3)

产品变更通知 (PCN) (15)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020 年 4 月 14 日
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Change of die thickness from 11 mils to 7 mils for R9 72M (Large Die) assembled in TQFP 100 leads, 14 x 20 x 1.4 mm package
2018 年 5 月 27 日
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (5)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

IBIS (1)

2010 年 11 月 22 日

Verilog (1)

2008 年 11 月 13 日

BSDL (1)

2008 年 11 月 13 日

VHDL (1)

2008 年 11 月 13 日