CY7C1474V25-200BGI | 赛普拉斯半导体
CY7C1474V25-200BGI
Status: 生产中
数据手册
(pdf, 767.28 KB)
CY7C1474V25-200BGI
| 架构 | NoBL, Pipeline |
| 合格汽车 | 否 |
| 密度 (Kb) | 73728 |
| Density (Mb) | 72 |
| 频率 (MHz) | 200 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 2.60 |
| 最高工作电压 (V) | 2.63 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 2.40 |
| 最低工作电压 (V) | 2.38 |
| 组织 (X x Y) | 1Mb x 72 |
| Part Family | NoBL |
| Part Family | NoBL |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $179.20 | $156.80 | $153.44 | $150.08 | $146.72 | $143.36 |
Packaging/Ordering
工具包
No. of Pins
209
Package Dimensions
551 L x 1.8 H x 866 W (Mils)
Package Weight
1 160.20 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
840
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
否
Lead/Ball Finish
Sn/Pb
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 7 月 28 日
技术文档
应用笔记 (3)
产品变更通知 (PCN) (6)
2018 年 5 月 27 日
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
2018 年 5 月 27 日
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
2018 年 5 月 27 日
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
Product Information Notice (PIN) (3)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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