CY7C199NL-15ZXCT | 赛普拉斯半导体

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CY7C199NL-15ZXCT
Status: 废弃

数据手册

(pdf, 390.07 KB) RoHS PB Free

CY7C199NL-15ZXCT

合格汽车
密度 (Kb)256
频率 (MHz)
最高工作温度 (°C)70
Max. Operating VCCQ (V)5.50
最高工作电压 (V)5.50
最低工作温度 (°C)0
Min. Operating VCCQ (V)4.50
最低工作电压 (V)4.50
组织 (X x Y)32K x 8
Part Family快速异步 SRAM
速率 (ns)15
Tape & Reel
温度分类商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.64 $2.22 $1.98 $1.74 $1.64 $1.54
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (1)

产品变更通知 (PCN) (9)

2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Product Information Notice (PIN) (5)

2020 年 5 月 7 日
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

2020 年 4 月 14 日
Addendum to PTN173701A - October 2017 Product Obsolescence Notification
2020 年 4 月 14 日
Addendum to PTN173701 - October 2017 Product Obsolescence Notification
2020 年 4 月 14 日
October 2017 Product Obsolescence Notification

白皮书 (1)

2016 年 4 月 12 日

VHDL (1)

2012 年 4 月 09 日

IBIS (1)

2009 年 9 月 15 日