CY7C199NL-15ZXCT | 赛普拉斯半导体
CY7C199NL-15ZXCT
| 合格汽车 | 否 |
| 密度 (Kb) | 256 |
| 频率 (MHz) | 无 |
| 最高工作温度 (°C) | 70 |
| Max. Operating VCCQ (V) | 5.50 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | 0 |
| Min. Operating VCCQ (V) | 4.50 |
| 最低工作电压 (V) | 4.50 |
| 组织 (X x Y) | 32K x 8 |
| Part Family | 快速异步 SRAM |
| 速率 (ns) | 15 |
| Tape & Reel | 是 |
| 温度分类 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.64 | $2.22 | $1.98 | $1.74 | $1.64 | $1.54 |
Packaging/Ordering
工具包
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Qualification Report
Last Update: 2016 年 9 月 18 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 19 日
技术文档
应用笔记 (1)
产品变更通知 (PCN) (9)
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (5)
2020 年 5 月 7 日
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
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