CY7C53120E2-10SXI | 赛普拉斯半导体
CY7C53120E2-10SXI
| 合格汽车 | 否 |
| 闪存 (KB) | 2 |
| Max. Input Clock (MHz) | 10 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.00 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 5.00 |
| ROM (KB) | 10 |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| 联系销售人员 | |||||
Packaging/Ordering
工具包
No. of Pins
32
Package Dimensions
810 L x 0 H x 450 W (Mils)
Package Weight
1 340.00 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
875
Minimum Order Quantity (MOQ)
875
Order Increment
875
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 5 月 19 日
技术文档
应用笔记 (1)
产品变更通知 (PCN) (15)
2020 年 7 月 14 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 32-Lead SOIC Package.
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Qualification of Cypress Minnesota as Alternate Wafer Fabrication Facility for Neuron® Chip Network Processor Products
2018 年 5 月 28 日
Qualification of KEG6000DA and KEG3000DA Green Mold Compound for 32 leads, Lead-free and standard, 450 mil body size, SOIC Packages Assembled at Cypress
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (4)
2018 年 5 月 27 日
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Cypress Manufacturing Minnesota
Product Information Notice (PIN) (6)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
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