CY7C60455-48LTXC | 赛普拉斯半导体

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CY7C60455-48LTXC
Status: 废弃

数据手册

(pdf, 798.22 KB) RoHS PB Free

CY7C60455-48LTXC

Development KitCY3660
合格汽车
最高工作温度 (°C)70
最高工作电压 (V)3.60
最低工作温度 (°C)0
最低工作电压 (V)1.71
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.87 $2.48 $2.35 $1.96 $1.90 $1.77
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
QFN
No. of Pins
48
Package Dimensions
276 L x 35 H x 276 W (Mils)
Package Weight
145.21 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

技术文档

应用笔记 (6)

产品变更通知 (PCN) (6)

2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Qualification of Amkor Philippines as an Additional Assembly Site for 48 QFN (7X7X1.0mm) Package
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (4)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020 年 7 月 21 日
Q32020 Automotive Horizon Report Update
2020 年 4 月 22 日
Q220 Automotive Horizon Report Update
2020 年 4 月 22 日
Q220 Standard Horizon Report Update

Product Information Notice (PIN) (6)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Termination Notice (PTN) (2)

2020 年 4 月 24 日
Addendum to PTN201304 - April 2020 Product Obsolescence Notification
2020 年 3 月 29 日
April 2020 Product Obsolescence Notification