CY7C63803-LQXC | 赛普拉斯半导体

You are here

CY7C63803-LQXC
Status: 生产中

数据手册

(pdf, 860.67 KB) RoHS PB Free

CY7C63803-LQXC

应用Mouse, Wireless Dongle
合格汽车
CPU CoreM8C
数据传输中断
I/O 选项USB, PS/2, SPI, GPIO
最高工作温度 (°C)70
最高工作电压 (V)5.50
存储器架构闪存
存储器大小 (KB)8
最低工作温度 (°C)0
最低工作电压 (V)4.00
No. of Endpoints3
I/O 数目14
软件工具C-Compiler (CY366x)
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.69 $2.33 $2.20 $1.84 $1.78 $1.66
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (1)

2020 年 5 月 28 日

产品变更通知 (PCN) (9)

2020 年 4 月 23 日
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2018 年 5 月 29 日
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
2010 年 4 月 22 日
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (2)

2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Q319 Horizon Report Update

Product Information Notice (PIN) (6)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels