CY7C63803-SXC | 赛普拉斯半导体
CY7C63803-SXC
| Development Kit | CY3655 |
| 应用 | Mouse, Wireless Dongle |
| 合格汽车 | 否 |
| CPU Core | M8C |
| 数据传输 | 中断 |
| I/O 选项 | USB, PS/2, SPI, GPIO |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 5.50 |
| 存储器架构 | 闪存 |
| 存储器大小 (KB) | 8 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 4.00 |
| No. of Endpoints | 3 |
| I/O 数目 | 14 |
| 软件工具 | C-Compiler (CY366x) |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.20 | $1.90 | $1.80 | $1.50 | $1.45 | $1.35 |
Packaging/Ordering
工具包
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1440
Minimum Order Quantity (MOQ)
1920
Order Increment
1920
Estimated Lead Time (days)
119
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 2 月 07 日
Last Update: 2020 年 2 月 06 日
Package Qualification Report
Last Update: 2019 年 10 月 30 日
Last Update: 2015 年 8 月 07 日
Last Update: 2015 年 8 月 07 日
技术文档
应用笔记 (1)
产品变更通知 (PCN) (16)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 27 日
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Product Information Notice (PIN) (6)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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