CY7C64215-28PVXC | 赛普拉斯半导体
CY7C64215-28PVXC
| Development Kit | CY3664 |
| 应用 | Gaming Mice, Keyboard, Joystick |
| 合格汽车 | 否 |
| CPU Core | M8C |
| 数据传输 | 批量，中断，同步 |
| I/O 选项 | I2C, 8-Bit UART, SPI, RF Interface |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 5.25 |
| 存储器架构 | 闪存 |
| 存储器大小 (KB) | 16 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.15 |
| No. of Endpoints | 4 |
| I/O 数目 | 22 |
| 软件工具 | PSoC Designer |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.01 | $2.60 | $2.46 | $2.05 | $1.99 | $1.85 |
Packaging/Ordering
工具包
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2350
Minimum Order Quantity (MOQ)
1410
Order Increment
1410
Estimated Lead Time (days)
77
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 4 月 30 日
Last Update: 2020 年 2 月 07 日
Last Update: 2020 年 2 月 05 日
Last Update: 2020 年 2 月 05 日
Package Qualification Report
Last Update: 2015 年 8 月 07 日
Last Update: 2015 年 8 月 07 日
Last Update: 2015 年 8 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 16 日
技术文档
开发套件/板 (1)
软件和驱动程序 (1)
产品变更通知 (PCN) (11)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; enCoReTM III CY7C64215 Device Family
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (6)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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