CY7C64215-28PVXC | 赛普拉斯半导体

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CY7C64215-28PVXC
Status: 生产中

数据手册

(pdf, 1.15 MB) RoHS PB Free

CY7C64215-28PVXC

Development KitCY3664
应用Gaming Mice, Keyboard, Joystick
合格汽车
CPU CoreM8C
数据传输批量,中断,同步
I/O 选项I2C, 8-Bit UART, SPI, RF Interface
最高工作温度 (°C)70
最高工作电压 (V)5.25
存储器架构闪存
存储器大小 (KB)16
最低工作温度 (°C)0
最低工作电压 (V)3.15
No. of Endpoints4
I/O 数目22
软件工具PSoC Designer
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.92 $5.11 $4.84 $4.04 $3.92 $3.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 220 24-48 hours

Packaging/Ordering

工具包
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1410
Minimum Order Quantity (MOQ)
1410
Order Increment
1410
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

封装材料声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 16 日

技术文档

开发套件/板 (1)

软件和驱动程序 (1)

产品变更通知 (PCN) (11)

2018 年 5 月 28 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; enCoReTM III CY7C64215 Device Family
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (3)

2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

用户模块数据表 (27)

参考设计 (1)