CY7C64315-16LKXC | 赛普拉斯半导体

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CY7C64315-16LKXC
Status: 生产中

数据手册

(pdf, 604.11 KB) RoHS PB Free
(pdf, 1.33 MB) RoHS PB Free

CY7C64315-16LKXC

Development KitCY3660
合格汽车
最高工作温度 (°C)70
最高工作电压 (V)5.50
最低工作温度 (°C)0
最低工作电压 (V)3.00
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.75 $2.38 $2.25 $1.88 $1.82 $1.70
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
QFN
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

技术文档

技术参考手册(1)

应用笔记 (1)

产品变更通知 (PCN) (8)

2020 年 5 月 08 日
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (6)

2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families