CY7C64356-48LTXCT | 赛普拉斯半导体
CY7C64356-48LTXCT
| Development Kit | CY3660 |
| 应用 | Gaming Mice, Keyboard, Joystick |
| 合格汽车 | 否 |
| CPU Core | M8C |
| 数据传输 | 批量，中断，同步 |
| I/O 选项 | USB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 5.50 |
| 存储器架构 | 闪存 |
| 存储器大小 (KB) | 32 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.00 |
| No. of Endpoints | 8 |
| I/O 数目 | 36 |
| 软件工具 | PSoC Designer |
| Tape & Reel | 是 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.29 | $2.84 | $2.69 | $2.24 | $2.17 | $2.03 |
Packaging/Ordering
工具包
No. of Pins
48
Package Dimensions
276 L x 35 H x 276 W (Mils)
Package Weight
145.21 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
315
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 8 月 21 日
Package Qualification Report
Last Update: 2016 年 9 月 19 日
Last Update: 2015 年 8 月 07 日
技术文档
技术参考手册（1）
应用笔记 (1)
产品变更通知 (PCN) (5)
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Qualification of Amkor Philippines as an Additional Assembly Site for 48 QFN (7X7X1.0mm) Package
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (9)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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