CY7C65620-56LTXC | 赛普拉斯半导体

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CY7C65620-56LTXC
Status: 生产中

数据手册

(pdf, 816.71 KB) RoHS PB Free

CY7C65620-56LTXC

Development KitCY4605
合格汽车
I/O 选项SPI
最高工作温度 (°C)70
最高工作电压 (V)3.45
最低工作温度 (°C)0
最低工作电压 (V)3.15
No. of Hub Ports2
Single/Multi TTSingle
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.69 $9.23 $8.75 $7.29 $7.07 $6.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 190 24-48 hours

Packaging/Ordering

No. of Pins
56
Package Dimensions
315 L x 1 H x 315 W (Mils)
Package Weight
174.18 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(B.4.B)
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

应用笔记 (2)

产品变更通知 (PCN) (7)

2020 年 4 月 23 日
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2020 年 4 月 14 日
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
2018 年 5 月 29 日
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (2)

2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Q319 Horizon Report Update

Product Information Notice (PIN) (5)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

勘误表 (1)

参考设计 (1)

IBIS (1)

2010 年 6 月 02 日

技术文章 (1)