CY7C68014A-128AXC | 赛普拉斯半导体

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CY7C68014A-128AXC
Status: 生产中

数据手册

(pdf, 1.84 MB) RoHS PB Free
(pdf, 1.79 MB) RoHS PB Free
(pdf, 2.19 MB) RoHS PB Free

CY7C68014A-128AXC

Development KitCY3684
应用USB 高速外设
合格汽车
CPU CoreEnhanced 8051
数据传输批量,中断,同步
I/O 选项8/16 位数据总线,DMA,GPIO,I2C,UART
最高工作温度 (°C)70
最高工作电压 (V)3.60
存储器架构RAM
存储器大小 (KB)16
最低工作温度 (°C)0
最低工作电压 (V)3.00
No. of Endpoints7
I/O 数目40
软件工具Keil S/W Tools (available from Keil)
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.20 $15.02 $14.56 $13.65 $12.10 $11.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
QFP
No. of Pins
128
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
974.84 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
72
Minimum Order Quantity (MOQ)
72
Order Increment
72
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (17)

2020 年 5 月 28 日

产品变更通知 (PCN) (12)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (6)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

参考设计 (1)

代码示例 (1)

2018 年 10 月 09 日

技术文章 (1)