CY7C68320C-100AXC | 赛普拉斯半导体
CY7C68320C-100AXC
| Development Kit | CY4615B |
| 应用 | USB High-Speed Mass Storage Controller |
| 合格汽车 | 否 |
| 数据传输 | 批量，中断，同步 |
| I/O 选项 | ATA, ATAPI, Compact Flash, GPIO |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.00 |
| No. of Endpoints | 7 |
| I/O 数目 | 6 |
| 软件工具 | EZ-USB AT2 Programming Utility |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $21.04 | $16.83 | $15.81 | $14.66 | $14.03 | $13.39 |
Packaging/Ordering
工具包
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
144
Order Increment
144
Estimated Lead Time (days)
70
HTS Code
8542.39.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 5 月 11 日
Last Update: 2019 年 10 月 30 日
Package Qualification Report
技术文档
应用笔记 (4)
2018 年 4 月 04 日
产品变更通知 (PCN) (11)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (6)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
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