CY8C20234-12LKXIT | 赛普拉斯半导体

CY8C20234-12LKXIT
Status: 生产中

数据手册

(pdf, 1.23 MB) RoHS PB Free
(pdf, 1.32 MB) RoHS PB Free

CY8C20234-12LKXIT

Development KitCY3203A-DK
合格汽车
CPU CoreM8C
CapSense
通讯接口I2C,SPI
专用模数转换器(编号_最大分辨率 @ 采样速率)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)12
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)2.40
No. of CapSense Channels1
CapSense IO 数目10
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
GPIO 编号13
可编程数字模块编号0
PWMSW
近程传感
SRAM (KB)0.5
具有 SmartSense 功能
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.77 $1.70 $1.62 $1.55 $1.48 $1.35
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au/Ag;Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

技术参考手册(1)

应用笔记 (18)

开发套件/板 (2)

2018 年 8 月 29 日

软件和驱动程序 (2)

产品变更通知 (PCN) (9)

2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 16-Lead QFN Pb - Free package assembled in Amkor-Phil
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (7)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

用户模块数据表 (12)

IBIS (1)

2014 年 3 月 04 日

技术文章 (2)