CY8C20234-12SXIT | 赛普拉斯半导体
CY8C20234-12SXIT
| Development Kit | CY3203A-DK |
| 合格汽车 | 否 |
| CPU Core | M8C |
| CapSense | 是 |
| 通讯接口 | I2C，SPI |
| 专用模数转换器（编号_最大分辨率 @ 采样速率） | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 无 |
| 闪存 (KB) | 8 |
| LCD Direct Drive | 否 |
| 最高工作频率 (MHz) | 12 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.40 |
| No. of CapSense Channels | 1 |
| CapSense IO 数目 | 10 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| GPIO 编号 | 13 |
| 可编程数字模块编号 | 0 |
| PWM | SW |
| 近程传感 | 否 |
| SRAM (KB) | 0.5 |
| 具有 SmartSense 功能 | 否 |
| Tape & Reel | 是 |
| USB (Type) | 无 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $1.64 | $1.58 | $1.51 | $1.44 | $1.37 | $1.25 |
Packaging/Ordering
工具包
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2021 年 3 月 22 日
Last Update: 2020 年 2 月 06 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 15 日
技术文档
应用笔记 (18)
2020 年 6 月 26 日
产品变更通知 (PCN) (7)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 6 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Product Information Notice (PIN) (7)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
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