CY8C20334-12LQXIT | 赛普拉斯半导体

CY8C20334-12LQXIT
Status: 生产中

数据手册

(pdf, 848.78 KB) RoHS PB Free
(pdf, 936.99 KB) RoHS PB Free

CY8C20334-12LQXIT

Development KitCY3203A-DK
合格汽车
CPU CoreM8C
CapSense
通讯接口I2C,SPI
专用模数转换器(编号_最大分辨率 @ 采样速率)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)12
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)2.40
No. of CapSense Channels1
CapSense IO 数目17
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
GPIO 编号20
可编程数字模块编号0
PWMSW
近程传感
SRAM (KB)0.5
滑条3
具有 SmartSense 功能
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.97 $1.89 $1.81 $1.73 $1.64 $1.50
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

IPC 1752 材料成分声明

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

技术文档

技术参考手册(1)

应用笔记 (18)

开发套件/板 (1)

软件和驱动程序 (2)

产品变更通知 (PCN) (9)

2018 年 5 月 29 日
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 28 日
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
2010 年 4 月 22 日
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (1)

2019 年 7 月 21 日

Product Information Notice (PIN) (5)

2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

用户模块数据表 (13)

IBIS (1)

2014 年 3 月 04 日

技术文章 (3)