CY8C20434-12LQXIT | 赛普拉斯半导体
CY8C20434-12LQXIT
| Development Kit | CY3280-BK1 |
| 合格汽车 | 否 |
| CPU Core | M8C |
| CapSense | 是 |
| 通讯接口 | I2C，SPI |
| 专用模数转换器（编号_最大分辨率 @ 采样速率） | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 无 |
| 闪存 (KB) | 8 |
| LCD Direct Drive | 否 |
| 最高工作频率 (MHz) | 12 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 2.40 |
| No. of CapSense Channels | 1 |
| CapSense IO 数目 | 25 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| GPIO 编号 | 28 |
| 可编程数字模块编号 | 0 |
| PWM | SW |
| 近程传感 | 否 |
| SRAM (KB) | 0.5 |
| 滑条 | 5 |
| 具有 SmartSense 功能 | 否 |
| Tape & Reel | 是 |
| USB (Type) | 无 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.09 | $2.00 | $1.91 | $1.83 | $1.74 | $1.59 |
Packaging/Ordering
工具包
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.24 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Qualification Report
Last Update: 2016 年 9 月 19 日
Last Update: 2016 年 9 月 19 日
Last Update: 2015 年 8 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 19 日
Last Update: 2016 年 9 月 15 日
技术文档
技术参考手册（1）
应用笔记 (18)
2015 年 8 月 26 日
开发套件/板 (2)
软件和驱动程序 (2)
产品变更通知 (PCN) (9)
2018 年 5 月 28 日
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
2018 年 5 月 28 日
Qualification of Carsem Malaysia as an Additional Assembly Site for 32-lead QFN (5X5X0.6 mm) Package Products Using the Saw Singulation Process
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (8)
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation