CY8C21234-24SXI | Cypress Semiconductor

CY8C21234-24SXI
Status: 生产中

数据手册

(pdf, 2.04 MB) RoHS PB Free
(pdf, 935.22 KB) RoHS PB Free

CY8C21234-24SXI

Development KitCY3213A-DK, CY3212-16SOIC
合格汽车
Boost Converter (V)1.2
CPU CoreM8C
CapSense
通讯接口I2C, SPI, UART
专用模数转换器(编号_最大分辨率 @ 采样速率)DelSig(1,10 位 @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)2.40
No. of CapSense Channels1
CapSense IO 数目8
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
GPIO 编号12
可编程模拟模块编号1
可编程数字模块编号3
PWMHW
近程传感
SRAM (KB)0.5
滑条1
具有 SmartSense 功能
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.20 $2.11 $2.02 $1.93 $1.83 $1.68
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 270 24-48 hours

Packaging/Ordering

工具包
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1680
Minimum Order Quantity (MOQ)
1680
Order Increment
1680
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (27)

2018 年 3 月 05 日
2018 年 3 月 02 日

开发套件/板 (10)

软件和驱动程序 (2)

产品变更通知 (PCN) (19)

2019 年 6 月 19 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of KYEC as an Alternate Wafer Sort Site for SONOS4 Technology; CY8C21xxx Device Family
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21xxx Device Family
2018 年 5 月 28 日
Advance PCN: Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 28 日
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21X34 Device Family.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (4)

2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels
2016 年 2 月 05 日
Datasheet changes to CY8C21x34 Products

用户模块数据表 (40)

Programming Specifications (1)

白皮书 (1)

参考设计 (1)

2015 年 1 月 20 日

IBIS (1)

2014 年 3 月 04 日

技术文章 (6)