CY8C21312-12PVXET | 赛普拉斯半导体
CY8C21312-12PVXET
| Development Kit | CY3213A-DK, CY3212-20SSOP |
| 合格汽车 | 是 |
| CPU Core | M8C |
| CapSense | 是 |
| 通讯接口 | I2C, SPI, UART |
| 专用模数转换器（编号_最大分辨率 @ 采样速率） | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 无 |
| 闪存 (KB) | 8 |
| LCD Direct Drive | 否 |
| 最高工作频率 (MHz) | 12 |
| 最高工作温度 (°C) | 125 |
| 最高工作电压 (V) | 5.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 3.00 |
| No. of CapSense Channels | 1 |
| CapSense IO 数目 | 12 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated UART | 0 |
| GPIO 编号 | 16 |
| 可编程模拟模块编号 | 0 |
| 可编程数字模块编号 | 1 |
| PWM | HW |
| 近程传感 | 是 |
| SRAM (KB) | 0.5 |
| 滑条 | 2 |
| 具有 SmartSense 功能 | 否 |
| Tape & Reel | 是 |
| USB (Type) | 无 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.26 | $3.12 | $2.99 | $2.85 | $2.71 | $2.49 |
Packaging/Ordering
工具包
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 5 月 12 日
Last Update: 2020 年 2 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 20 日
技术文档
应用笔记 (27)
2020 年 6 月 26 日
2020 年 6 月 26 日
产品变更通知 (PCN) (5)
2020 年 5 月 6 日
Qualification of HHGrace Fab 3 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
2020 年 5 月 6 日
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020 年 4 月 14 日
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020 年 4 月 14 日
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Product Information Notice (PIN) (5)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
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