CY8C21323-24PVXI | 赛普拉斯半导体

CY8C21323-24PVXI
Status: 生产中

数据手册

(pdf, 681.52 KB) RoHS PB Free
(pdf, 732.52 KB) RoHS PB Free

CY8C21323-24PVXI

Development KitCY3215-DK, CY3213-20SSOP
合格汽车
CPU CoreM8C
CapSense
专用模数转换器(编号_最大分辨率 @ 采样速率)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)4
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)2.40
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
GPIO 编号16
可编程模拟模块编号4
可编程数字模块编号4
SRAM (KB)0.25
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.63 $1.56 $1.49 $1.43 $1.36 $1.24
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2640
Minimum Order Quantity (MOQ)
2640
Order Increment
2640
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (33)

2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 5 月 29 日

开发套件/板 (7)

2018 年 8 月 29 日
2018 年 3 月 19 日
2018 年 2 月 15 日
2018 年 1 月 24 日
2018 年 1 月 24 日

软件和驱动程序 (2)

产品变更通知 (PCN) (13)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21x23 Device Family
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21x23 Device Family
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for PSoC CY8C21x23 product family on SONOS4 technology
2018 年 5 月 27 日
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

2018 年 5 月 27 日
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

用户模块数据表 (44)

Programming Specifications (1)

IBIS (1)

2012 年 6 月 08 日