CY8C21334B-24PVXI | 赛普拉斯半导体

CY8C21334B-24PVXI
Status: 生产中

数据手册

(pdf, 894.97 KB) RoHS PB Free
(pdf, 1.49 MB) RoHS PB Free

CY8C21334B-24PVXI

Development KitCY3213A-DK, CY3212-20SSOP
合格汽车
CPU CoreM8C
CapSense
通讯接口I2C, SPI, UART
专用模数转换器(编号_最大分辨率 @ 采样速率)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)2.40
No. of CapSense Channels1
CapSense IO 数目12
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
GPIO 编号12
可编程模拟模块编号1
可编程数字模块编号3
PWMHW
近程传感
SRAM (KB)0.5
滑条2
具有 SmartSense 功能
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.53 $2.42 $2.32 $2.21 $2.11 $1.93
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 220 24-48 hours

Packaging/Ordering

工具包
SOP
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
660
Minimum Order Quantity (MOQ)
660
Order Increment
660
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016 年 9 月 16 日

技术文档

应用笔记 (27)

2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 5 月 29 日

产品变更通知 (PCN) (5)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (5)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (1)

2014 年 3 月 04 日