CY8C21334W-12PVXET | 赛普拉斯半导体

CY8C21334W-12PVXET
Status: 生产中

数据手册

(pdf, 2.11 MB) RoHS PB Free
(pdf, 1.49 MB) RoHS PB Free

CY8C21334W-12PVXET

Development KitCY3213A-DK, CY3212-20SSOP
合格汽车
CPU CoreM8C
CapSense
通讯接口I2C, SPI, UART
专用模数转换器(编号_最大分辨率 @ 采样速率)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)12
最高工作温度 (°C)125
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of CapSense Channels1
CapSense IO 数目12
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
GPIO 编号16
可编程模拟模块编号1
可编程数字模块编号3
PWMHW
近程传感
SRAM (KB)0.5
滑条2
具有 SmartSense 功能
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.58 $3.43 $3.28 $3.13 $2.98 $2.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
SOP
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

技术文档

应用笔记 (32)

2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 5 月 29 日
2020 年 5 月 28 日

产品变更通知 (PCN) (4)

2020 年 5 月 6 日
Qualification of HHGrace Fab 3 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
2020 年 5 月 6 日
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020 年 4 月 14 日
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020 年 4 月 14 日
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1

Product Information Notice (PIN) (3)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines