CY8C23533-24LQXI | 赛普拉斯半导体

CY8C23533-24LQXI
Status: 生产中

数据手册

(pdf, 1.36 MB) RoHS PB Free
(pdf, 746.61 KB) RoHS PB Free
(pdf, 809.85 KB) RoHS PB Free

CY8C23533-24LQXI

Development KitCY3215-DK, CY3207-Pod
合格汽车
CPU CoreM8C
CapSense
专用模数转换器(编号_最大分辨率 @ 采样速率)SAR (1, 8-bit @ 375 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)8
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
GPIO 编号26
可编程模拟模块编号4
可编程数字模块编号4
SRAM (KB)0.25
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.27 $3.69 $3.57 $3.22 $2.91 $2.33
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au

IPC 1752 材料成分声明

Last Update: 2016 年 10 月 11 日

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (27)

2018 年 3 月 05 日
2018 年 3 月 02 日

开发套件/板 (1)

2018 年 8 月 29 日

产品变更通知 (PCN) (3)

2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (1)

2019 年 7 月 21 日

Product Information Notice (PIN) (2)

2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels

用户模块数据表 (56)

IBIS (1)

2012 年 6 月 08 日