CY8C27543-24AXI | 赛普拉斯半导体
CY8C27543-24AXI
| Development Kit | CY3215-DK, CY3207-Pod |
| 合格汽车 | 否 |
| CPU Core | M8C |
| CapSense | 否 |
| 专用模数转换器（编号_最大分辨率 @ 采样速率） | 无 |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 无 |
| 闪存 (KB) | 16 |
| LCD Direct Drive | 否 |
| 最高工作频率 (MHz) | 24 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 2 |
| No. of Dedicated UART | 2 |
| GPIO 编号 | 40 |
| 可编程模拟模块编号 | 12 |
| 可编程数字模块编号 | 8 |
| SRAM (KB) | 0.25 |
| Tape & Reel | 否 |
| USB (Type) | 无 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $8.95 | $7.73 | $7.49 | $6.76 | $6.11 | $4.88 |
Packaging/Ordering
工具包
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1600
Minimum Order Quantity (MOQ)
320
Order Increment
320
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
无
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 7 月 10 日
技术文档
应用笔记 (66)
2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 6 月 26 日
2018 年 2 月 19 日
2015 年 8 月 25 日
开发套件/板 (9)
软件和驱动程序 (2)
产品变更通知 (PCN) (19)
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C27X43 Device Family.
2018 年 5 月 28 日
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 27 日
This is a correction to the Method of Identification section in the just released PCN#071421. Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
2018 年 5 月 27 日
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
2018 年 5 月 27 日
Qualification of Grace Semiconductor as an Additional Wafer Foundry Site for
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (7)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
用户模块数据表 (64)
2015 年 3 月 27 日
2015 年 3 月 25 日
2013 年 8 月 02 日
2013 年 6 月 19 日
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