CY8C28645-24LTXI | 赛普拉斯半导体

CY8C28645-24LTXI
Status: 生产中

数据手册

(pdf, 1.21 MB) RoHS PB Free
(pdf, 1.29 MB) RoHS PB Free
(pdf, 1.88 MB) RoHS PB Free

CY8C28645-24LTXI

Development KitCY3215-DK, CY3207-Pod
合格汽车
CPU CoreM8C
CapSense
专用模数转换器(编号_最大分辨率 @ 采样速率)SAR (1, 10-bit @ 192 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)16
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C2
No. of Dedicated OpAmps0
No. of Dedicated SPI3
No. of Dedicated UART3
GPIO 编号44
可编程模拟模块编号16
可编程数字模块编号12
SRAM (KB)1
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.66 $5.43 $5.19 $4.95 $4.71 $4.32
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
QFN
No. of Pins
48
Package Dimensions
276 L x 276 H x 35 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Ni/Pd/Au/Ag;Ni/Pd/Au

技术文档

应用笔记 (42)

2021 年 3 月 02 日
2020 年 6 月 26 日

开发套件/板 (2)

产品变更通知 (PCN) (4)

2020 年 5 月 4 日
Qualification of HHGrace Fab3 as an Additional Wafer Fab Site for Select Industrial PSoC® 1 Products
2020 年 4 月 14 日
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

IBIS (1)

2012 年 6 月 08 日