CY8C29466-24SXI | 赛普拉斯半导体

CY8C29466-24SXI
Status: 生产中

数据手册

(pdf, 1.12 MB) RoHS PB Free
(pdf, 1.79 MB) RoHS PB Free
(pdf, 1.73 MB) RoHS PB Free

CY8C29466-24SXI

Development KitCY3215-DK, CY3211-28SOIC
合格汽车
CPU CoreM8C
CapSense
专用模数转换器(编号_最大分辨率 @ 采样速率)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)32
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI4
No. of Dedicated UART4
GPIO 编号24
可编程模拟模块编号12
可编程数字模块编号16
SRAM (KB)2
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.78 $9.31 $9.02 $8.13 $7.35 $5.88
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 100 24-48 hours

Packaging/Ordering

工具包
SOP
No. of Pins
28
Package Dimensions
705 L x 0 H x 300 W (Mils)
Package Weight
830.75 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
135
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

封装材料声明

Last Update: 2016 年 11 月 08 日

技术文档

应用笔记 (59)

2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 5 月 29 日
2017 年 5 月 31 日
2017 年 5 月 4 日

开发套件/板 (7)

软件和驱动程序 (2)

产品变更通知 (PCN) (18)

2018 年 5 月 28 日
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
2018 年 5 月 28 日
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
2018 年 5 月 28 日
Add Alternate Assembly Site for SOIC150mils Pb-Free
2018 年 5 月 28 日
Add Alternate Assembly Site for SOIC300mils Pb-Free.
2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
2018 年 5 月 28 日
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
2018 年 5 月 27 日
Change in Tube Bundling Ship Process
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Product Information Notice (PIN) (6)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

用户模块数据表 (65)

Programming Specifications (1)

参考设计 (1)

2015 年 1 月 20 日

IBIS (1)

2012 年 3 月 15 日

技术文章 (1)