CY8C29866-24AXI | 赛普拉斯半导体

CY8C29866-24AXI
Status: 生产中

数据手册

(pdf, 1.12 MB) RoHS PB Free
(pdf, 1.79 MB) RoHS PB Free
(pdf, 1.73 MB) RoHS PB Free

CY8C29866-24AXI

Development KitCY3215-DK, CY3211-100TQFP
合格汽车
CPU CoreM8C
CapSense
专用模数转换器(编号_最大分辨率 @ 采样速率)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)
闪存 (KB)32
LCD Direct Drive
最高工作频率 (MHz)24
最高工作温度 (°C)85
最高工作电压 (V)5.25
最低工作温度 (°C)-40
最低工作电压 (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI4
No. of Dedicated UART4
GPIO 编号64
可编程模拟模块编号12
可编程数字模块编号16
SRAM (KB)2
Tape & Reel
USB (Type)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.44 $7.12 $6.81 $6.50 $6.19 $5.67
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

工具包
QFP
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
450
Order Increment
450
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (59)

2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 6 月 26 日
2020 年 5 月 29 日
2017 年 5 月 31 日
2017 年 5 月 4 日

开发套件/板 (7)

软件和驱动程序 (2)

产品变更通知 (PCN) (16)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020 年 5 月 8 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018 年 5 月 28 日
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018 年 5 月 28 日
PSoC Product Datasheet Changes
2018 年 5 月 28 日
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
2018 年 5 月 28 日
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (6)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

用户模块数据表 (67)

Programming Specifications (1)

IBIS (1)

2012 年 3 月 15 日